High-Tech Services
In VIAS3D, we offer a wide variety of simulation solutions to meet the challenges of high-tech industries focusing on continuously changing user specific design-concepts, shorter product delivery time, and complex manufacturing processes all around the globe. With our outstanding simulation capabilities of advanced material modeling (composite/polymers), shock and moisture sensitivity, progressive fracture/failure, coupled frequency response, signal integrity and power-delivery efficiency analysis, we can help you with your specific high-tech modeling problems.











FEA
- Circuit Boards: Low-cycle fatigue life and fracture mechanics of solder joints, electronic chips, leads, resistors, diodes, capacitors, transistors
- Semiconductors: Wirebond fatigue failures, stress analysis of bonded joints, thermal analysis of a semiconductor chamber, thermo-mechanical behavior
- Cell phone and hand-held device: Efficient geometric design and failure analysis, display, device dimension optimization
CFD
- Thermal Analysis: PCBs, heat-pipes, power electronics, graphics cards, integrated circuits
- Consumer Electronics: Flow and thermal applications in home appliances such as refrigerators, washing machines and air-conditioners, laptops
- Data Center cooling: Cooling of clusters, power electronics, computers, peripherals
- Acoustics: Cooling fan acoustics, duct acoustics



EMAG
- Antenna Engineering: Placement performance, co-site interference RF desensitization, SAR, radome design, thermal simulation
- EMC/EMI Performance: Circuit simulation, PCB design validation, circuit-EM simulation, cables, connectors, enclosures, switching circuits, emission simulation
- PCB Performance: Serial high–speed and parallel data links, DC drop, PDN high frequency noise.
Related Blogs
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Design of Dish Antenna Under an Extreme Wind Event
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VIAS3D
Introduction
Wind loading on dish antenna is an important parameter...
13
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Structural Simulation for Consumer Electronics Design
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Consumer Electronics industry is growing rapidly, new & updated technologies, ever increasing number of featu...
13
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Understanding 5G Indoor and Outdoor Wireless Propagation with the power of SBR solver
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The 5th generation of mobile networks is immensely popular due to its features such as fast communication, ultra-...
13
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Thermal Fatigue Assessment of Solder Joint Using Abaqus/CAE – Sustainable & Socially Responsible Development During COVID-19
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Posted by
VIAS3D
Electronic manufacturing companies are facing serious problems because of solder joint failure. It is one of the ...
12
Feb
Getting Ahead with 5G Development for Multiple Industries
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Posted by
VIAS3D
Electromagnetics (EMAG) and RF/Microwave is known to society since the 16th century when mariners observed t...